…Semiconductor package design and technology development work. In order to achieve the best possible characteristics, cost, and quality for semiconductor chips, we

…Global Pay grade: Up to Global Pay Grade P5 Division: HPC AI & Cloud Engineering Division (291800000000) Location: Dusseldorf, Munich, Dresden or remote within

…In this role, you will be part of the AI & Cloud Engineering (ACE) Division and the Product Management team. ACE is developing a comprehensive AI strategy that

…+ Development of AI compiler framework, high performance kernel authoring and acceleration onto next generation of hardware architectures. + Contribute to the

…*Hiring will be into all Renesas EMEA and APAC offices, either for hybrid work or remotely* In this role, you will be part of the AI & Cloud Engineering (ACE)