IC Resources
Photonics Packaging Engineer
Job Location
Pisa, Italy
Job Description
My client is looking for a Packaging Engineer , experienced in photonic and optoelectronic devices to join their R&D team , onsite in Italy! You’ll lead the design, assembly, and optimisation of cutting-edge photonic packaging solutions , working within a collaborative, cross-functional team that supports your growth and development. Your Responsibilities Design and develop photonic and optoelectronic packaging solutions Create mechanical and optical component layouts Support micro-optical and fiber optic assembly process Engage in semiconductor assembly process Must Haves Masters degree in Physics, Electronics Engineering or similar Semiconductor, photonics packaging, micro-optical assembly process knowledge CAD Design tools eg. SolidWorks Good to Have Understanding of PICs Cleanroom and advanced packaging technologies experience This is a super exciting opportunity to work for innovative generative AI technologies alongside industry-leading scientists. If you're interested, contact Ella Flynn at IC Resources J-18808-Ljbffr
Location: Pisa, Toscana, IT
Posted Date: 11/17/2025
Location: Pisa, Toscana, IT
Posted Date: 11/17/2025
Contact Information
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