Photonics Packaging Engineer

Our international start-up client is currently seeking an Engineer with experience in the packaging of photonic and optoelectronic devices to join the R&D team. The successful candidate will be responsible for the design, assembly, and optimization of advanced photonic packaging solutions, contributing directly to the development of next-generation photonic systems. The ideal candidate combines strong technical expertise in photonics packaging and semiconductor assembly with excellent communication and teamwork skills, and thrives in a collaborative, cross-functional environment. This position is suited for an engineer with some professional experience who is motivated to grow within a multidisciplinary team. Required skills for the Photonic Packaging Engineering will include: Knowledge of semiconductor and photonics packaging concepts Familiarity with semiconductor assembly processes, including flip-chip and wire-bonding manufacturing flows Experience working in a cleanroom or precision assembly environment Strong verbal and written communication skills Master’s degree in Physics, Electrical Engineering, Electronics Engineering, or related field Please contact Rachel Anderson for further details.

Location: Pisa, Tuscany, IT

Posted Date: 11/8/2025