Senior Engineer - (Mechanical & Thermal Analysis)

Senior Engineer - (Mechanical & Thermal Analysis) 22 Ang Mo Kio Ind Park 2, Singapore 569506 Req 463 Please join us! Responsibilities: Perform mechanical & thermal analysis and characterization of advanced IC packages Build up new mechanical & thermal capabilities with latest simulation and characterization technologies Design advanced packages for customers to meet their reliability and manufacturability specifications & needs Assess the feasibility of new packaging assembly and process technologies with respect to mechanical and reliability performance Conduct IC packaging technology development together with other teams Carry out mechanical, thermal and reliability test and correlate with mechanical & thermal simulation for validation Requirements: Degree / Master in Mechanical Engineering or related field Solid knowledge on FEM & mechanics of material Mechanical modeling experience for IC package’s stress & warpage, board-level reliability such as drop test & TCOB using simulation software such as Ansys or Abaqus is a must Thermo-mechanical modeling experience for IC assembly molding process, die stress/shifting in WLCSP, and wire bonding using simulation software such as Ansys & Abaqus is preferable Mechanical and reliability test experience such as drop test, TCOB test, warpage measurement, bending test, material strength test is highly desirable Thermal Modeling experience using CFD software such as Flotherm / Icepak is highly desirable Team player with good interpersonal and communication skills Keen for R&D activities in IC packaging technology development, package’s mechanical & thermal analysis/ design/ optimization/ characterization J-18808-Ljbffr

Location: Singapore, SG

Posted Date: 6/18/2025