Senior/Principal Engineer, HIG-HBM Product Engineering (Media Health Manufacturing)

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This includes leading the manufacturing test flow development and validation, improving the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with a cross-functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc.) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM is exciting and dynamic. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage: The responsibility of ensuring optimized test coverage on all current and future HIG HBM design architectures and process nodes is a technical aspect of this role. This is crucial for maintaining the effectiveness and efficiency in high-volume manufacturing. Product Development and Validation: This role is pivotal in developing, validating, characterizing, and qualifying Micron’s next-generation HBM products. Ensuring that these products are reliable and meet the necessary standards is a technical task that directly impacts the market readiness of the products. Support for New Product Design Validation: The role provides support for design verification and in-depth circuit of new products using CAD tools and Verilog simulations. This technical support is crucial for the development of new products and technologies. Yield Improvement and Cost Reduction: The role involves technical tasks like improving manufacturing test yields (specifically related to Device Issues from the DRAM, Interface and Stacked Die Yield), reducing test time, and resolving yield-related issues. These activities are critical for cost reduction and meeting yield targets. Root Cause and Resolution: Addressing Manufacturing Test Flow Issues, Qual and RMA Device Issues. Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron’s competitive edge in the market. Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization. Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions. Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development. Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products. Requirements: Bachelors/Masters Electrical and Electronics Engineering Degree with 7 years of experience in the semiconductor industry. Product Engineering experience is preferred. Demonstrating Strong Leadership Skills and Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis. Good knowledge of statistics and data analysis tools and scripting. Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs). Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems. Strong sense of responsibility and accountability towards assigned role with professional work ethic. Excellent communication and presentation skills. Passionate about people leadership, with a drive toward ongoing learning and development in this area. Work on site in Singapore with international travel to US, Taiwan and Japan. J-18808-Ljbffr

Location: Singapore, SG

Posted Date: 5/29/2025