Senior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization ([]

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about innovation, using expertise to enable breakthroughs in virtual reality, neural networks, supercomputing, and artificial intelligence. We are committed to integrity, sustainability, and community engagement, fueling the innovation we pursue. Micron’s vision is to transform how the world uses information to enrich life for all . Join a global team focused on innovation to deliver high-value technology solutions. Our work helps make virtual reality, supercomputing, and AI breakthroughs possible, all while maintaining our commitments to integrity and sustainability. We are currently experiencing a transformative period in artificial intelligence, driven by advances in memory and compute technologies, notably high bandwidth memory (HBM). Micron’s Advanced Packaging Technology Development (APTD) team is responsible for developing high-performance memory packaging solutions and transferring these to manufacturing. We are seeking a Post-Fab Wafer Finish (PWF) Engineer to join our APTD team. Your responsibilities include developing and deploying processes related to post-fab wafer finishing in semiconductor manufacturing, ensuring performance, cost efficiency, manufacturability, quality, reliability, and schedule adherence. You will collaborate across organizations to coordinate technology development and integration for future solutions. Key responsibilities: Process Development: Establish and improve PWF processes such as wafer thinning and backside metal interconnect. Upgrade process capabilities and reduce production costs. Manage process projects to meet technology node requirements and scaling for future nodes. Equipment and Materials: Evaluate and promote new equipment and materials to enhance processes. Set up process parameters for semiconductor equipment. Plan for new equipment and materials adoption. Quality Improvement: Ensure comprehensive process coverage through measurement, inspection, and testing. Establish correlations to identify improvement opportunities. Analyze data continuously to implement advanced controls. Collaboration and Coordination: Work closely with internal and external partners on technology strategies. Coordinate with teams such as Package Integration, Assembly Engineering, Wafer Fab, and Quality to optimize manufacturing processes. Ensure smooth transition from development to high-volume manufacturing and provide documentation for product transfer. Requirements: B.S/M.S./Ph.D. in Chemical, Electrical, Mechanical Engineering, Physics, or related fields. At least 2 years of experience in semiconductor process development, preferably in wafer bonding, plating, warpage control, or packaging. Strong understanding of process flows, interactions, and their impact on yield, performance, and reliability. Experience with DOE, SPC, defect analysis, and data analysis. Ability to work effectively under timelines and resource constraints. A proven track record of problem-solving and root cause analysis. About Micron: We are a leader in memory and storage solutions, transforming how the world uses information. Our innovations support AI, 5G, and data economy advancements, from data centers to edge devices. Visit micron.com/careers to learn more. We are committed to equal employment opportunity and provide accommodations upon request. Contact hrsupport_sg@micron.com for assistance. We prohibit child labor and comply with all relevant laws and standards. Micron does not charge candidates recruitment fees. J-18808-Ljbffr

Location: Singapore, SG

Posted Date: 5/24/2025