R&D – Head of Embedded NVM Technologies

Social network you want to login/join with: R&D – Head of Embedded NVM Technologies, Lecce Client: Theron Solutions Location: Lecce, Italy Job Category: Other EU work permit required: Yes Job Reference: 4287033516446711808337152 Job Views: 2 Posted: 26.04.2025 Expiry Date: 10.06.2025 Job Description: THIS ROLE REQUIRES A RELOCATION TO DHOLERA, INDIA once the FAB is built. Responsibilities: Integration responsibilities to add eNVM (embedded Non Volatile Memory) Features to 28 110nm platform technologies including MTP and Flash. Work with IP providers, as needed, to implement these features. Design and Layout of test chips to aid in device/technology optimization, rel assessment, and SPICE model extraction. End to end Project Management from initial project justification to final qualification and yield ramp with responsibilities for achieving desired performance, quality/yield, schedule, and cost targets. Build and lead a cross-functional team across diverse geographies. Build strong customer relationships based on confidence in the company's technical capabilities. Ownership of technology roadmap and competitor benchmarking. Presentations to internal and customer senior executives. Possible involvement in OTP development. Travel (few weeks per quarter). Additional qualities: Ability to manage, mentor, and lead a team of highly motivated professionals. Independent, self-motivated, with a strong drive to win. Team player capable of working across diverse cross-functional teams worldwide. Leadership skills to influence all organizational levels. Inclusive, adaptable to various global norms. Curious, resilient, data-driven approach to challenges. Collaborative, relationship-builder, supportive, open-minded. Innovative, creative, quick to adapt. Qualifications: M.S or PhD in Electrical Engineering, Materials Science, or equivalent. Strong understanding of CMOS and eNVM device physics, process modules, yield improvement, failure mechanisms, analytical techniques (physical and electrical). Deep knowledge of key eNVM technologies (charge trap, floating gate, RRAM, MRAM, etc.). Understanding of technology parameters and figures of merit (bit cell size, macro size, endurance, retention, power, latency, mask count, etc.); experience in achieving competitive performance. Proven track record in delivering these technologies into volume manufacturing. Ability to lead cross-functional teams and meet project timelines and budgets. Experience working across cultures and geographies. Team player with a focus on innovation and competitiveness. Desired Experience Level: 15 years of experience in the semiconductor industry. Successful track record of developing new technologies into high-volume production. Strong problem-solving skills using design of experiments and analytical tools. EOE: Our client is an Equal Opportunity Employer committed to a work environment free from discrimination and harassment. Employment decisions are based on business needs, job requirements, and individual qualifications, without regard to race, color, religion, sex, age, disability, HIV status, sexual orientation, gender identity, marital status, military service, family medical history, genetic information, or any other protected characteristic. J-18808-Ljbffr

Location: provincia-di-lecce, IT

Posted Date: 5/9/2025