Semicon Process Engineering Director

Understand customer requirements and meet/exceed customer goals. Drive team to set up stable manufacturing processes with CpK >1.67. Drive engineering discipline (use DOEs and Statistical Process Engineering tools) in cost, yield, and quality improvement. Arrange training for Process Managers and Engineers. Deploy FDC and SPC on key equipment. Partnership with cross-functional teams to meet production schedules, quality, and safety. Customer engineering and issues resolution. Requirement: Degree in Electrical/Electronics/Mechanical/Chemical Engineering/Chemistry or its equivalent with a minimum of 15 years engineering experience in wafer fab or wafer bumping house, with at least 5 years management experience as a Director/Deputy Director level in a fast-moving environment. Thorough knowledge of wafer level packaging, engineering, and production. Have experience in setting up FDC and SPC. All successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits. We regret that only shortlisted candidates will be notified. J-18808-Ljbffr

Location: Singapore, SG

Posted Date: 5/1/2025